Adhesives and Sub-floor preparations

Proflex MS Polymer Adhesive Single component, solvent free flexible adhesive. Suitable for under-floor heating.
 
Fastrack DPM Single component water based moisture suppressant. One coat application. Dries from blue to clear typically in 30 minutes. Works up to 97% RH Proflex Gun Grade MS Polymer Single component, solvent free flexible adhesive. Suitable for under-floor heating. Proflex SV 15 P Solvent based adhesive Kerakoll Products l L36 AdhesiveL36 Adhesive Solvent free two component, high resistant elastic adhesive.
 
Suitable for all engineered floors and solids up to 350mm wide. Suitable for under-floor heating. EP21 Primer Solvent free two component epoxy resin for use with L36 Adhesive. 1 coat acts as a primer, 2 coats act as a DPM S11 Adhesive Low solvent based single component adhesive.
 
Suitable for engineered floors up to 15mm thick and solid floors up to 120mm wide. Suitable for under-floor heating. CS Primer Single component for use with S11 adhesive. L40 Flex Single component solvent free flexible adhesive. Approximately 1kg = 1m2 (depending on trowels notch size). Bona D500 Solvent free one component primer for the preparation of substrates prior to the use of parquet adhesives. Kerakoll Trowel